
3DLAC Plus is the next evolution of the famous 3DLAC adhesive, now available in a convenient spray bottle that allows for precise application.
Specifically formulated to work with fiber-reinforced filaments, 3DLAC Plus provides superior adhesion to the build bed, ensuring that the first layer remains firmly in place without shifting. This product is essential for achieving high-precision prints and for working with materials that require greater control and stability.
Features:
- Spray bottle format: Allows for easy and precise application of the adhesive to the print surface.
- Compatible with fiber-reinforced filaments: Offers extra adhesion, ideal for reinforced materials that are typically more demanding.
- Warping Prevention: Ensures that the print remains flattened and stable.
- Easy cleaning: Remaining 3DLac Plus can be easily removed with water, leaving the circuit board ready for the next use.
Application:
To use 3DLAC Plus, shake the spray bottle well and apply a light coat to a clean, dry surface before starting to print. Use in a well-ventilated area. After printing, allow the print to COOL COMPLETELY before carefully removing it. Attempting to remove the print before the plate is cool may damage the surface treatment of your printed circuit board.
Suggested use:
ABS, Carbon filled, metal filled, wood filled