Anycubic Rigid 100 resin

Anycubic Rigid 100 Resin

Exceptional adaptability and increased rigidity

Excellent heat resistance

Extra durability and excellent rigidity

This resin has twice the toughness of regular rigid resin, with a toughness upgraded to 90 MPa. This makes it more resistant to deformation under load and less prone to distortion.

Better performance with Photon Mono M7 Pro

The Anycubic Photon Mono M7 Pro is optimized for Rigid 100 Resin and features dynamic temperature control in the resin tank, which reduces the viscosity of the resin and improves flow. This heating function is particularly beneficial for the high-viscosity Rigid 100 Resin, making molding easier and increasing the success rate of printing.

Resin parameters

• Wavelength: 365-405 nm

• Elongation at break: 5-7%

• Density: 1.14 g/cm³

• Bending strength: 95-110 MPa

• Viscosity: 950-1150 mPa·s

• Flexural modulus: 2800-3400 MPa

• Surface hardness: 88-90 D

• Tensile strength: 80-85 MPa

• First layer exposure time: 23-35 seconds

• Normal exposure time: 2-2.8 seconds

• Recommended printing temperature: above 25°C

• Shelf life: 1.5 years

• Cleaning time: 95% ethanol / isopropyl alcohol

• Curing method: 60°C for 30 minutes under UV light and in a warm environment

• Heat distortion temperature: 105°C

Model view

Color types

Instructions for use

1. Before use:
   Shake liquid resin thoroughly before use. Clean the resin container and build platform to ensure the bottom of the resin container is clear for light penetration.

2. During use:
   Unscrew the lid and add resin to the resin container according to the equipment requirements. Select the correct printing parameters and settings for the print.

3. After use:
   After printing, use appropriate post-processing tools such as knife, nipper, tweezers, containers, and gloves. Clean the model with water.

4. Finishing:
   Remove the printed model from the build platform with a knife. Submerge the model in cleaning fluid, rinse or ultrasonic cleaner, then remove to drain. ANYCUBIC Wash & Cure machines are recommended for best results. Perform post-processing such as support removal, polishing, staining, etc.

5. Wastewater management:
   A. Do not discharge wastewater directly into the sewer system to avoid groundwater contamination.
   B. Heat the wastewater so that most of the water evaporates, and then discard the residual material after curing with a curing machine and sunlight.

Precautions:

1. Resin is best stored in a cool, dark place at room temperature and protected from light to avoid high temperatures and sunlight.

2. Recommended operating temperature is 25°C. Lower temperatures may affect print quality, and resin can therefore be carefully preheated before use (max 70°C).

3. If the pigment in the resin settles, the resin can be used after shaking.

4. To preserve the properties of the resin, the model should be removed from the cleaning fluid immediately after cleaning to avoid deterioration from prolonged immersion in isopropyl alcohol and water absorption.

5. To ensure the mechanical properties of the model, post-curing should be done in a timely manner after cleaning and drying.

6. For optimal curing, light intensity and exposure time must be controlled:

   • Intensity of mercury lamp or LED light should be 5-10 mW/m² with a duration of max. 1 hour (self-adjustment).

   • Sunlight exposure in summer should be about 1 hour.

   • Avoid close contact or prolonged exposure to strong light sources such as high-pressure mercury lamps.

   • Preferably print in a dark room or with a cover, as resin is photosensitive.

   • To avoid yellowish discoloration with High Clear Resin, it is recommended to halve the exposure time compared to other resin colors.

   • Black resin can be partially transparent in walls thinner than 0.5 mm; thicker layers give better color effect.

Note: Material properties may vary depending on printer, post-cure method and testing equipment. For safety information, please refer to the product MSDS. For problems with use, please contact support.