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Bambu Lab

Bambu Engineering Plate

Bambu Engineering Plate

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Regular price 313,21 DKK
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Free shipping on orders over 500,- in DK

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Ships from Roskilde DK

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Local service center in Roskilde

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1 year warranty

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Bambu Engineering Plate

Product Features
Optimised for high-temperature filaments
Compatible with all filament types
Designed for long-lasting performance

Important

Glue must be applied before printing with any material on the Engineering Plate.

One build plate for all filaments
With a simple layer of glue, the Engineering Plate is compatible with our entire filament range and is the ideal standard solution when you're unsure which plate to choose.

Durable, smooth surface coating
The updated coating significantly improves the plate's resistance to heat, scratches, and corrosion. It is built to withstand long-term high-temperature printing as well as hundreds of washes and removals. The smooth and reliable surface ensures stable adhesion—every single time.

Smooth and natural surface finish
The smooth base coating gives the underside of the printed object an even and flat texture, which blends more naturally with other surfaces.

Important Notes

  1. Before printing with any filament, it is recommended to apply glue to the Engineering Plate. Using solid glue sticks can make it easier to remove the object, but since solid glue has a certain thickness and is difficult to apply evenly, print stability and first-layer quality are usually not as good as with liquid glue. Liquid glue, on the other hand, can make object removal more difficult. Therefore, choose the glue type based on the filament, printing environment, and other practical considerations. For more details, refer to the official wiki: Bambu Lab Wiki.

  2. When using a scraper to remove prints, ensure the correct technique is applied. If the model is too firmly attached to the build plate, you can apply alcohol to the interface between the model and the plate to reduce adhesion and facilitate removal. This helps prevent damage to the model, build plate, or personal injury due to excessive force.

  3. A higher hotbed temperature improves adhesion. The user should adjust the hotbed temperature according to their needs to achieve the most appropriate level of adhesion.

  4. For the X1, P1, and A1 series, before automatic levelling, it is necessary to repeatedly rub the nozzle against the wiping area on the build plate to thoroughly remove any material residue on the nozzle tip. The coating in the wiping area will gradually wear off over time—this is normal and does not affect print quality or nozzle lifespan, so there is no need to worry.

  5. Dust and grease deposits on the build plate can reduce adhesion. It is recommended to regularly clean the build plate with warm water and detergent to maintain optimal adhesion. Do not use other unapproved cleaning agents.

  6. Bambu Lab exclusively recommends using official Bambu Lab glue on Bambu Lab build plates and cannot be held responsible for damage to plates caused by the use of third-party glues. Do not clean the Engineering Plate with acetone, as it will damage the plate's surface.

  7. Always wait a few minutes before removing printed objects to allow the plate to cool down. This makes removal easier and prevents damage to the plate, ensuring the product's long lifespan.

  8. The latest firmware includes significant improvements to the calibration of the Bambu Engineering Plate using Micro Lidar and is now fully compatible with the automatic calibration process.

  9. The Engineering Plate is considered a wear part that degrades over time. The warranty only covers manufacturing defects and not cosmetic damage such as scratches, dents, or cracks. Only plates defective upon receipt are covered by the warranty.

 

Recommended Settings
Note: Other slicer settings may need to be adjusted depending on the printed model and filament requirements
Material Hotbed Temperature Requires Glue Stick?
PLA / PLA-CF / PLA-GF 45–60 °C Glue stick / liquid glue
PETG / PETG-CF 60–80 °C Glue stick / liquid glue
ABS (not for A1 mini) 90–100 °C Glue stick / liquid glue
ASA (not for A1 mini) 90–100 °C Glue stick / liquid glue
TPU 35–45 °C Glue stick / liquid glue
PVA 45–60 °C Glue stick / liquid glue
PC / PC-CF (not for A1 mini) 90–110 °C Glue stick / liquid glue
PA / PA-CF / PAHT-CF (not for A1 mini) 90–110 °C Glue stick / liquid glue
PET-CF (not for A1 mini) 80–100 °C Glue stick / liquid glue

 

Specification Details
Material Polyester powder + manganese steel
Surface Temperature Resistance Up to 120 °C
Thickness 0.5 mm
Applicable Print Size X1C / P1P / P1S / A1 / P2S – 256 × 256 mm
H2D / H2S – 350 × 320 mm
H2C – 330 × 320 mm
Packaging Size X1C / P1P / P1S / A1 / P2S – 315 × 295 × 15 mm
H2D / H2S – 393 × 380 × 15 mm
H2C – 393 × 380 × 15 mm
Packaging Weight 0.50 kg
0.78 kg
0.78 kg